Surface Mount Technology

 

AWS Group is a leading UK based whole-service Electronics Manufacturing Solutions Provider and has a substantial investment in modern PCB assembly facilities at each of its European plants. This comprehensive capability allows AWS to undertake both PTH and SMT projects, ranging from rapid prototyping to medium-high volume contracts utilising the latest PCB technology.

  • Prototyping, low to medium volumes (1-50,000)
  • Medium-to-high complexity assemblies
  • Build to Aerospace, Military, Telecoms (BABT), rail, medical and engineering capability
  • RoHS and leaded process and engineering capability
  • HASS, Environmental and Vibration Test Chambers
  • Conformal Coating & Encapsulation
  • Water & Solvent ultrasonic cleaning machines
  • Manufacture to IPC 610 Class 3, single or multi-shift

Surface Mount Capability

  • 9 pick & place lines
  • BGA & micro BGA placement to ± 50 µm with on-machine camera
  • Chip Scale Package (CSP) and Chip on Board (CoB) placement
  • Component handling sizes down to 01005
  • Fine pitch QFP placement accuracy ±30 µm
  • Maximum component size 52x52mm
  • 3D X-ray, Ersa 650 re-work station and re-balling of BGA and micro-BGAs
  • Board up to 650x410mm or 510x460mm, 0.5-5mm thick

Quality and Standards

  • NADCAP 7003
  • J-STD-001
  • AS/EN 9100
  • ISO 14001
  • ISO 9001
  • ISO-13485

Today’s assembly demands cover a wide variety of component footprints. At AWS we primarily focus on the front end engineering; we believe that you cannot simply “inspect quality in”.

Box Build  |  Cables and Harness  |  Conventional Assembly (PTH)